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Swiss Photonic Integration Center (Swiss PIC)

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Integrated photonic systems are disrupting existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others. The complexity of photonic packaging is increasing and assembly &amp; packaging, testing and qualification are challenging. The newly established Swiss Photonics Integration Center (Swiss PIC) addresses these needs by providing precision assembly and packaging solutions for Swiss industry, especially start-ups and SMEs. We will provide photonic packaging services for volumes form single prototypes to pilot series. The center which is located in the Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute will invest in qualified industrialized processes, high-tech machinery, and will over time build up a full production line for optical precision assembly.
<h2>Tasks</h2>
The Opportunity: Swiss PIC is seeking a Packaging Design Engineer to assist our packaging production line. You will have responsibility for the design and simulation of micro optical packaging solutions for a wide range of PIC based systems. In collaboration with our packaging process experts you will design solutions which can insure the optimal system performance based on the systems optical, mechanical and thermal characteristics and taking into account production capabilities, tolerances and workflows. Together with our customers you will chose the designs of the interfaces for current packaging projects as well as develop guidelines for future improvements of designs. As an important player in the photonics packaging community, we will also help develop the standards for layouts and interfaces for the future photonics integrated circuit industry. As a team we will solve highly varying technical challenges while enabling Swiss photonic device companies to develop highly specialized packaging and in doing so we will be part of establishing the center as a leader in the field in Switzerland and Europe. 
 Your tasks:
<ul>
<li>Design state-of-art packaging solutions for micro optical systems and photonic integrated circuits (PICs).</li>
<li>Assist customers in choosing the right interface solutions for current ad future needs.</li>
<li>Collaborate with our process engineers to design solutions which take into account production tolerances and workflows.</li>
<li>Work with partners to help define the future standards for layouts and interfaces for photonic chips</li>
<li>Document and report to internal members and communicate with external vendors, customers, and partners.</li>
</ul>
<h2>Requirements</h2>
Your skills and expertise:
• MS/PhD in engineering, 2-7 years’ experience in design and simulation of micro optical systems.
• Experience with modelling and design tools such as Lumerical, Zemax, Comsol, Ansys, HFSS and ADS and/or Solidworks
• Willingness to travel if needed.
• Solid written communication, presentation and documenting skills.
• A drive to be an important actor in the growth of the Swiss and EU PIC ecosystem
<h2>Benefits</h2>
We offer:
<ul>
<li>A flexible and dynamic start-up work environment. </li>
<li>A highly international, diverse and highly motivated team. </li>
<li>Personal responsibility in your job and the chance to grow with us. </li>
<li>Our passion to bring PICs to every day’s life.</li>
</ul>
Activity rate: 100%, Place of work: Villingen (CH) Start date: October 2023
How to apply: We look forward to receiving your full application, including 1) your CV, 2) a statement of interest relating the position to your skills and 3) grades or work certificates. Non-complete applications may not be considered. Applications will be considered as they come in with an expected deadline of August 15th.

Packaging Design Engineer

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