Swiss Photonic Integration Center (Swiss PIC)

With the ever-increasing demand of photonic systems in existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others, the complexity of photonic packaging is also increasing. Common challenges for Swiss industry, especially start-ups and SMEs include assembly & packaging, testing and qualification and therefore support in these areas is crucial. The newly established Swiss Photonics Integration Center (Swiss PIC) addresses these needs.

Swiss PIC provides precision assembly and packaging solutions for photonics systems. The complete packaging offering - including optical, electrical, thermal and mechanical technology - ensures a controlled interfacing of photonic systems with the environment. Building up on a long history of precision engineering in Switzerland, the photonics packaging center offers highest standards in terms of quality and precision. It provides customers with packaging services covering prototyping as well as series production. The center located in the Switzerland Innovation Park InnovAare next to PSI and will invest in qualified industrialized processes, high-tech machinery, and operate a qualified piloting and production line over time in Park InnovAare.The Swiss Photonics Integration Center (Swiss PIC) is a member of the Advanced Manufacturing Technology Transfer Centers (AM-TTC) Alliance. The center is funded by the ETH Board as well as by federal funds according to Art. 15 FIFG.