Customer Tape Out Engineer - Integrated Photonics

LIGENTEC is a fast-growing European company with headquarter in Lausanne, Switzerland. Since 2021 we expanded our manufacturing capabilities by creating LIGENTEC France, in the South of Paris. We specialize in the design & manufacturing of Photonic Integrated Circuits (PICs) for customers in high-tech areas such as Quantum Technologies, LiDAR, Space Technologies, and Biosensors.

LIGENTEC All-Nitride (AN) technology enables our customers to develop their products in the Industrial Revolution 4.0.

You are about to enter this unique opportunity to bring R&D to product.

To support our continued growth, we are looking for a:

Customer Tape Out Engineer - Integrated Photonics

• Client Design Interface: Engage directly with client design teams to thoroughly understand their chip designs, advising on design for manufacturability (DFM) to ensure optimal compatibility with our fabrication processes.
• Design Verification and Optimization: Perform comprehensive checks on client photonic integrated circuit (PIC) layouts, ensuring conformity with our foundry's design rules and manufacturability criteria, and suggest necessary optimizations.
• Data Preparation for Manufacturing: Accurately prepare and validate client design data for the mask-making process, ensuring all elements are correctly formatted and aligned with our foundry's capabilities.
• Comprehensive Design Rule Checking (DRC): Execute thorough DRC processes to identify and resolve layout violations, collaborating with clients to ensure designs are optimised for our manufacturing environment.
• Layout vs. Schematic (LVS) Accuracy: Ensure the physical layout precisely matches the client's schematic designs, making adjustments as needed to meet our stringent standards.
• Executing the Final Tape-Out Process: Lead the final tape-out process, meticulously preparing and validating all design files, ensuring they are production-ready, and submitting them for manufacturing within the agreed timelines.
• Process Enhancement: Actively contribute to the enhancement of DFM guidelines, tape-out procedures, and client interaction protocols to continuously improve efficiency, manufacturability, and client satisfaction.

• Bachelor’s or Master’s degree in Electrical Engineering, Physics, Materials Science, or a related technical field
• Experience in the semiconductor industry, particularly in tape-out roles within a foundry environment, demonstrating a deep understanding of the tape-out process and its criticality in chip manufacturing
• Proficiency with EDA tools used in mask data preparation, preference on Mentor, Synopsys
• Experience with scripting languages (e.g., Python) for automation and process efficiency
• Knowledge of semiconductor manufacturing processes, especially photolithography
• Excellent communication and interpersonal abilities, capable of effectively collaborating with both clients and internal teams.
• Attention to detail and commitment to achieving high-quality outcomes.
• Excellent problem-solving skills, with the ability to identify, analyse, and resolve complex technical issues.
• Photonics experience is a strong plus
• Ability to work in a team and independently.

• A flexible and dynamic start-up work environment
• A highly international, diverse and highly motivated team
• Personal responsibility in your job and the chance to grow with us
• Our passion to bring PICs to everyday life.

We look forward to receiving your full application including 1) your CV, 2) a statement of interest (relating the position to your skills) and 3) grade or work certificates. Non-complete applications may not be considered.