apheros AG

Due to the rapid growth of AI and high-performance computing, conventional air cooling is no longer sufficient. Direct-to-chip liquid cooling has emerged as the solution.

The apheros metal foam is positioned to keep the next-gen chips cool. They can be used in single- and two-phase DLC.

Beyond thermal performance, our materials excel in a wide range of applications, including green hydrogen production, energy storage, catalysis, high-temperature filtration, and more.