Swiss Photonic Integration Center (Swiss PIC)

Technology, Information and Internet

1-10

Switzerland

Integrated photonic systems are disrupting existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others. The complexity of photonic packaging is increasing and assembly & packaging, testing and qualification are challenging. The newly established Swiss Photonics Integration Center (Swiss PIC) addresses these needs by providing precision assembly and packaging solutions for Swiss industry, especially start-ups and SMEs. We will provide photonic packaging services for volumes form single prototypes to pilot series. The center which is located in the Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute will invest in qualified industrialized processes, high-tech machinery, and will over time build up a full production line for optical precision assembly.

## Tasks

Swiss PIC is seeking a Senior Packaging Engineer to run our packaging production line. You will have responsibility for the hands-on implementation of packaging assembly processes involved in a wide range of PIC based systems, from initial packaging concept development, through packaging and subsequent testing. In collaboration with our design and simulation experts you will have a central role in defining the packaging processes and subsequently deliver the results. You will be a leading player in defining the future services of a leading supplier of PIC packaging services in Europe from an early stage and in deciding and implementing our significant equipment acquisition program. You will have a unique opportunity to help create and shape a start-up like activity in an innovative and strongly growing market with solid base funding from the beginning. As a team we will solve highly varying technical challenges while enabling Swiss photonic device companies to develop highly specialized packaging and in doing so we will be part of establishing the center as a leader in the field in Switzerland and Europe.

Your tasks:

• Develop state-of-art packaging technologies for photonic integrated circuits (PICs).

• Characterize and qualify the developed packaging solutions (optical/mechanical/reliability) and document the results for customers.

• Plan, acquire and support the installation of new equipment for our clean rooms and testing facilities

• Work with customers to define their photonics integration process.

• Work with partners to set up collaborations for external packaging services and with equipment manufacturers to set up training programs.

• Document and report to internal members and communicate with external vendors, customers and partners.

## Requirements

Your skills and expertise:

• MS/PhD in engineering, 5-10+ years’ experience in hybrid optical assembly with sub micron precision.

• Experience with precision assembly machines such as ficonTEC, finetec, nanosystec or aixemtec.

• Experience in high precision assembly using epoxies and other binders.

• Experience in working in a cleanroom environment is a plus.

• Experience in R&D process development .

• Willingness to travel if needed.

• Solid written communication, presentation and documenting skills.

• A drive to be an important actor in the growth of the Swiss and EU PIC ecosystem

## Benefits

**We offer:**

*   A flexible and dynamic start-up work environment. 
*   A highly international, diverse and highly motivated team.  
*   Personal responsibility in your job and the chance to grow with us. 
*   Our passion to bring PICs to every day’s life. 

**Activity rate:** 100%, **Place of work:** Villingen (CH)  **Start date:** October 2023

How to apply: We look forward to receiving your full application, including 1) your CV, 2) a statement of interest relating the position to your skills and 3) grades or work certificates. Non-complete applications may not be considered. Applications will be considered as they come in with an expected deadline of August 15th

Employee

Professional / Experienced

Integrated photonic systems are disrupting existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others. The complexity of photonic packaging is increasing and assembly &amp; packaging, testing and qualification are challenging. The newly established Swiss Photonics Integration Center (Swiss PIC) addresses these needs by providing precision assembly and packaging solutions for Swiss industry, especially start-ups and SMEs. We will provide photonic packaging services for volumes form single prototypes to pilot series. The center which is located in the Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute will invest in qualified industrialized processes, high-tech machinery, and will over time build up a full production line for optical precision assembly.
<h2 id="tasks">Tasks</h2>
Swiss PIC is seeking a Senior Packaging Engineer to run our packaging production line. You will have responsibility for the hands-on implementation of packaging assembly processes involved in a wide range of PIC based systems, from initial packaging concept development, through packaging and subsequent testing. In collaboration with our design and simulation experts you will have a central role in defining the packaging processes and subsequently deliver the results. You will be a leading player in defining the future services of a leading supplier of PIC packaging services in Europe from an early stage and in deciding and implementing our significant equipment acquisition program. You will have a unique opportunity to help create and shape a start-up like activity in an innovative and strongly growing market with solid base funding from the beginning. As a team we will solve highly varying technical challenges while enabling Swiss photonic device companies to develop highly specialized packaging and in doing so we will be part of establishing the center as a leader in the field in Switzerland and Europe.
Your tasks:
• Develop state-of-art packaging technologies for photonic integrated circuits (PICs).
• Characterize and qualify the developed packaging solutions (optical/mechanical/reliability) and document the results for customers.
• Plan, acquire and support the installation of new equipment for our clean rooms and testing facilities
• Work with customers to define their photonics integration process.
• Work with partners to set up collaborations for external packaging services and with equipment manufacturers to set up training programs.
• Document and report to internal members and communicate with external vendors, customers and partners.
<h2 id="requirements">Requirements</h2>
Your skills and expertise:
• MS/PhD in engineering, 5-10+ years’ experience in hybrid optical assembly with sub micron precision.
• Experience with precision assembly machines such as ficonTEC, finetec, nanosystec or aixemtec.
• Experience in high precision assembly using epoxies and other binders.
• Experience in working in a cleanroom environment is a plus.
• Experience in R&amp;D process development .
• Willingness to travel if needed.
• Solid written communication, presentation and documenting skills.
• A drive to be an important actor in the growth of the Swiss and EU PIC ecosystem
<h2 id="benefits">Benefits</h2>
We offer:
<ul>
<li>A flexible and dynamic start-up work environment. </li>
<li>A highly international, diverse and highly motivated team. </li>
<li>Personal responsibility in your job and the chance to grow with us. </li>
<li>Our passion to bring PICs to every day’s life.</li>
</ul>
Activity rate: 100%, Place of work: Villingen (CH) Start date: October 2023
How to apply: We look forward to receiving your full application, including 1) your CV, 2) a statement of interest relating the position to your skills and 3) grades or work certificates. Non-complete applications may not be considered. Applications will be considered as they come in with an expected deadline of August 15th

Senior Packaging Engineer

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