Engineer at Swiss PIC

Integrated photonic systems are disrupting existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others. The complexity of photonic packaging is increasing, and assembly & packaging, testing and qualification are challenging. The Swiss Photonics Integration Center (Swiss PIC) addresses these needs by providing precision assembly and packaging solutions for Swiss industry, especially start-ups and SMEs. We provide photonic packaging services for volumes from single prototypes to pilot series. The center, which is located in the Switzerland Innovation, Park InnovAARE, next to the Paul Scherrer Institute (PSI), is investing in qualified industrialized processes, clean environmentally controlled fabs, high-tech machinery, and has built up a full production line for optical precision assembly.

The Opportunity: We are seeking a skilled photonics engineer to join our team of photonic packaging experts. If you are already experienced in photonic packaging it is a great plus, otherwise an openness to learn and readiness to tackle the task at hand while learning from our experienced specialists is a must. If this is of your interest, send your application to join our international and dynamic team of experts dedicated to pushing the boundaries of what is possible in photonics and shape the future of technologies within communication, computing, quantum and beyond.

Your tasks:

• Work with customers to define and provide technical support for their photonics integration processes.
• Prototype, test, and iterate on interface designs, leveraging state-of-the-art tools and methodologies to achieve optimal performance and reliability.
• Characterize and qualify the developed packaging solutions and document the results for customers.
• Collaborate with the design and process engineering teams to develop and improve packaging solutions that meet performance requirements and manufacturing constraints.
• Stay current with advancements in materials science and packaging technologies, and propose innovative approaches to enhance the performance and reliability of photonic chip packaging.

Your skills and expertise:

• Bachelor's degree in Materials Science, Electrical or Mechanical Engineering, Physics, or a related field. Master's or Ph.D. preferred, industrial experience is a plus.
• Good connections in the local or national Swiss photonics community is a plus
• Experience with photonics, semiconductor packaging, microelectronics or micromechanics is highly desirable.
• Hands on photonic packaging equipment and process automation
• Strong analytical and problem-solving skills, with the ability to troubleshoot complex issues and propose effective solutions.
• Strong technical documentation skills and systematic reportingSelf-motivated and able to work independently with minimal supervision.
• Excellent problem-solving skills and a collaborative mindset, with the ability to work effectively in a dynamic, interdisciplinary environment.
• Solid communication skills in English and German required.
• A drive to be an important actor in the growth of the Swiss and EU PIC ecosystem

We offer:

• Opportunity to work on groundbreaking technology at the forefront of the industry, shaping the future of communication and computing.
• International, Collaborative and inclusive team culture that values creativity, diversity, and continuous learning.
• Personal responsibility in your job and the chance to grow with us.
• Our passion to bring PICs to every day’s life.

Employment rate: 100%, Place of work: Villigen (CH), Start date: from April 2025

Applications will be reviewed on a rolling basis, with priority given to those submitted before March 15, 2025.

Please attach grades and certificates to the CV